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AS1421-100


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Description
1 Part Non-Corrosive Neutral Cure Adhesive Sealant and Potting Material (Electronic Grade)
Feature
  • UL94V0 recognised in file No. E334038
  • Excellent thermal conductivity
  • Fast heat cure and adhesion
  • Contains 100 micron glass beads
Code
AS1421-100
Feature
Feature 1
UL94V0 recognised in file No. E334038
Feature 2
Excellent thermal conductivity
Feature 3
Fast heat cure and adhesion
Feature 4
Contains 100 micron glass beads
Appearance
Grey paste
Colour
Grey
Cure Type
Addition Heat Cure
Density
2.18 g/cm3
Dielectric Strength (V/mil)
>457 V/mil
Drying / Fixing Conditions
16 minutes at 100°C
Elongation at Break (%)
105 %
Hardness Shore A
56
Linear Coefficient of Thermal Expansion (ppm/°C)
195 ppm/°C
Max Storage Temperature
10 °C
Max Working Temp (°C)
210 °C
Min Storage Temperature
-5 °C
Min Working Temp (°C)
-50 °C
Rheology
Paste
RTV or Heat cure
Heat curing
Self Bonding
Yes
Shelf Life (mths)
12
Tensile Strength (N/mm2)
2.2 N/mm2
Test Conditions
After 60 minutes at 125°C
Thermal Conductivity (W/mK)
2.1 W/mK
UL 94V-0
Yes
UL File No.
E334038
Viscosity Mixed mPas
140000 - 240000 mPas
Volume Coefficient of Thermal Expansion (ppm/°C)
586 ppm/°C
Volume Resistivity (Ohms cm)
3.5E+13 ohms cm
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