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AS1701


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TDS
SDS
Description
1 Part Non-Corrosive Neutral Cure Adhesive Sealant (Electronic Grade)
Feature
  • Non corrosive
  • Excellent adhesion to most substrates
  • Fast skinning
  • Non slumping paste
Code
AS1701
Feature
Feature 1
Non corrosive
Feature 2
Excellent adhesion to most substrates
Feature 3
Fast skinning
Feature 4
Non slumping paste
100% Modulus (N/mm2)
2.1 MPa
Color
Black
Cure Profile
23+/-2°C and 50+/-5% humidity
Cure Through to 3 mm Depth
24 hr
Cure Type
Alkoxy
Density
1.28 g/cm3
Dielectric Breakdown (kV/mm)
33.33 kV
Dielectric Constant
2.92
Dielectric Strength (V/mil)
>457 V/mil
Dielectric Strength kV/mm
>18 kV/mm
Dissipation Factor
0.0012
Elongation at Break
200 %
Hardness Shore A
52
Lap Shear Aluminium kg/cm²
10.78 kg/cm²
Lap Shear Copper kg/cm²
10.06 kg/cm²
Lap Shear Polycarbonate Steel kg/cm²
5.93 kg/cm²
Lap Shear Stainless Steel 304 kg/cm²
2.98 kg/cm²
Linear Coefficient of Thermal Expansion (ppm/°C)
230 ppm/°C
Linear Shrinkage (%)
1 %
Max Storage Temperature
40 °C
Max Working Temp
220 °C
Min Working Temp
-50 °C
Rheology
Paste
RTV or Heat cure
RTV
Self Bonding
Yes
Shelf Life
12 mths
Tack Free Time / Skin Formation at 23°C/73°F
3 min
Tear Resistance (N/mm)
19.1 N/mm
Tensile Strength
2.35 N/mm2
Test Conditions
7 days at 23+/-2°C and 50+/-5% humidity
Thermal Conductivity
0.6 W/mK
Volume Coefficient of Thermal Expansion (ppm/°C)
690 ppm/°C
Volume Resistivity (Ohms cm)
7.85E+15 ohms cm
Youngs Modulus (N/mm2)
1.8 N/mm2
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