World class silicones for worldwide solutions

QSil 213


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TDS
SDS
Description
2 part encapsulation and potting silicone
Feature
  • Suitable for automatic dispensing or hand mixing
  • Low viscosity
  • Contains no solvents and a non-yellowing catalyst system
  • Designed for superior adhesion with use of a primer
Code
QSil 213
Feature
Feature 1
Suitable for automatic dispensing or hand mixing
Feature 2
Low viscosity
Feature 3
Contains no solvents and a non-yellowing catalyst system
Feature 4
Designed for superior adhesion with use of a primer
Coefficient of Thermal Expansion (cm/cm, °C)
27.5E-5 cm/cm°C
Colour
Clear colorless
Cure Type
Addition
Density A
1.02
Density B
1 g/cm3
Dielectric Constant
2.69
Dielectric Strength (V/mil)
500 V/mil
Dissipation Factor
0.0006
Drying / Fixing Conditions
30 mins at 100°C
Elongation at Break (%)
100 %
Gel Time at 25°C/77°F
6 hr
Hardness Shore A
45
Linear Shrinkage (%)
<0.1 %
Max Storage Temperature
38 °C
Max Working Temp (°C)
204 °C
Min Working Temp (°C)
-55 °C
Mix Ratio By Weight
10:1
Refractive Index
1.406
Rheology
Liquid
Shelf Life (mths)
24
Specific Heat (cal/g-°C)
0.3
Tensile Strength (N/mm2)
5.17 N/mm2
Thermal Conductivity (W/mK)
0.18 W/mK
Viscosity Mixed mPas
3700 mPas
Volume Resistivity (Ohms cm)
1700000000000000 ohms cm
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