World class silicones for worldwide solutions

SE2003


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TDS
SDS
Description
2 part encapsulation and potting silicone
Feature
  • Thermally conductive
  • Non corrosive
  • Low thermal outgassing (ECSS-Q-ST-70-02C)
  • Resistant to reversion
Code
SE2003
Feature
Feature 1
Thermally conductive
Feature 2
Non corrosive
Feature 3
Low thermal outgassing (ECSS-Q-ST-70-02C)
Feature 4
Resistant to reversion
Colour
Brick Red
Cure Type
Addition
De-mould Time / Full Cure at 23°C/73°F
24 hr hrs
Density
2.3 g/cm3
Dielectric Constant
6
Dielectric Strength (V/mil)
572 V/mil
Elongation at Break (%)
40 %
Hardness Shore A
80
Linear Shrinkage (%)
0.1 %
Max Storage Temperature
40 °C
Max Working Temp (°C)
250 °C
Min Working Temp (°C)
-50 °C
Mix Ratio By Weight
1:1
Pot Life at 23°C/73°F
2 hr mins
Rheology
Liquid
Shelf Life (mths)
9
Tear Resistance (N/mm)
3.3 N/mm
Tensile Strength (N/mm2)
3.21 N/mm2
Thermal Conductivity (W/mK)
1.27 W/mK
Viscosity Mixed mPas
35000 mPas
Volume Resistivity (Ohms cm)
3.00E+14 ohms cm
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