World class silicones for worldwide solutions

SE2005


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TDS
SDS
Description
2 part encapsulation and potting silicone
Feature
  • Low viscosity
  • Deep section cure
  • Excellent dielectric properties
  • Protects against shock and vibration
Code
SE2005
Feature
Feature 1
Low viscosity
Feature 2
Deep section cure
Feature 3
Excellent dielectric properties
Feature 4
Protects against shock and vibration
Colour
White
CTE Volumetric ppm/°C
762 ppm/°C
Cure Type
Condensation
De-mould Time / Full Cure at 23°C/73°F
24 hrs
Density
1.20 g/cm3
Density A
1.21
Density B
1.14 g/cm3
Dielectric Constant
3.4
Dielectric Strength kV/mm
>18 kV/mm
Elongation at Break (%)
180 %
Hardness Shore A
40
Linear Shrinkage (%)
0.5 %
Max Storage Temperature
40 °C
Max Working Temp (°C)
220 °C
Min Working Temp (°C)
-50 °C
Mix Ratio By Weight
100:1
Pot Life at 23°C/73°F
1 hr mins
Rheology
Liquid
RTV or Heat cure
RTV
Shelf Life (mths)
9
Tear Resistance (N/mm)
2 N/mm
Tensile Strength (N/mm2)
1.08 N/mm2
Test Conditions
7 days at 23+/-2°C and 50+/-5% humidity
Thermal Conductivity (W/mK)
0.24 W/mK
Viscosity A-Part mPas
9000 mPas
Viscosity B-Part mPas
300 mPas
Viscosity Mixed mPas
9000 mPas
Volume Resistivity (Ohms cm)
3E+14 ohms cm
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