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AS1723


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TDS
SDS
Description
1 Part Non-Corrosive Neutral Cure Adhesive Sealant and Potting Material (Electronic Grade)
Feature
  • Self levelling
  • Low odour
  • Non corrosive
  • Suitable for sensitive substrates
Code
AS1723
Feature
Feature 1
Self levelling
Feature 2
Low odour
Feature 3
Non corrosive
Feature 4
Suitable for sensitive substrates
100% Modulus (N/mm2)
0.43 MPa
Appearance
Viscous liquid
Colour
Translucent
Cure Through to 3 mm Depth
24 hr
Cure Type
Alkoxy
Density
1.03 g/cm3
Dielectric Constant
2.72
Dielectric Strength (V/mil)
>457 V/mil
Dielectric Strength kV/mm
>18 kV/mm
Dissipation Factor
0.0011
Drying / Fixing Conditions
23+/-2°C and 50+/-5% humidity
Elongation at Break (%)
216 %
Hardness Shore A
28
Linear Coefficient of Thermal Expansion (ppm/°C)
295 ppm/°C
Max Storage Temperature
40 °C
Max Working Temp (°C)
200 °C
Min Working Temp (°C)
-50 °C
Rheology
Self Level
RTV or Heat cure
RTV
Self Bonding
Yes
Shelf Life (mths)
12
Tack Free Time / Skin Formation at 23°C/73°F
11 min
Tensile Strength (N/mm2)
1 N/mm2
Test Conditions
7 days at 23+/-2°C and 50+/-5% humidity
Thermal Conductivity (W/mK)
0.2 W/mK
Viscosity Mixed mPas
72000 mPas
Volume Coefficient of Thermal Expansion (ppm/°C)
884 ppm/°C
Volume Resistivity (Ohms cm)
4.71E+15 ohms cm
Youngs Modulus (N/mm2)
0.3 N/mm2
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