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AS1402


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TDS
SDS
Description
1 Part Non-Corrosive Neutral Cure Adhesive Sealant (Electronic Grade)
Feature
  • Fast heat cure
  • Good adhesion to most substrates
  • Non slumping paste
  • Translucent
Code
AS1402
Feature
Feature 1
Fast heat cure
Feature 2
Good adhesion to most substrates
Feature 3
Non slumping paste
Feature 4
Translucent
100% Modulus (N/mm2)
0.54 MPa
Appearance
Thixotropic paste
Colour
Translucent
Cure Type
Addition Heat Cure
Density
1.03 g/cm3
Dielectric Strength (V/mil)
457 V/mil
Dielectric Strength kV/mm
18 kV/mm
Drying / Fixing Conditions
1 hour at 150°C, 2 hours at 100°C
Elongation at Break (%)
295 %
Extrusion Rate g/min
440 g/min
Hardness Shore A
30
Lap Shear Aluminium kg/cm²
8.25 kg/cm²
Linear Coefficient of Thermal Expansion (ppm/°C)
291 ppm/°C
Linear Shrinkage (%)
2 %
Max Storage Temperature
15 °C
Max Working Temp (°C)
200 °C
Min Storage Temperature
-5 °C
Min Working Temp (°C)
-50 °C
Rheology
Paste
RTV or Heat cure
Heat curing
Self Bonding
Yes
Shelf Life (mths)
6
Tear Resistance (N/mm)
3.1 N/mm
Tensile Strength (N/mm2)
1.5 N/mm2
Test Conditions
After 1 hour at 150°C
Thermal Conductivity (W/mK)
0.2 W/mK
Volume Coefficient of Thermal Expansion (ppm/°C)
874 ppm/°C
Volume Resistivity (Ohms cm)
>1E+15 ohms cm
Youngs Modulus (N/mm2)
0.38 N/mm2
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